Home › PTAB Cases › IPR2023-00900

Micron Technology, Inc. et al. vs. BeSang Inc.

Explore the PTAB proceeding IPR2023-00900 filed by Micron Technology, Inc. et al. on 2023-05-04. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Proceeding Overview

Proceeding Number

IPR2023-00900

Filing Date

2023-05-04

Accorded Filing Date

2023-05-04

Institution Decision Date

2023-11-17

Last Modified Date

2024-12-20

Proceeding Type

IPR

Termination Date

2024-11-13

Trial Status

Final Written Decision - Appealed

Parties & Counsel

Petitioner

Micron Technology, Inc. et al.

Represented By

Kappos, Johnet al

Patent Owner / Respondent

BeSang Inc.

Represented By

Armond, Michelleet al

Tribunal & Venue

Tribunal

Patent Trial and Appeal Board (USPTO)

Technology Center

TC 2800 - Semiconductors, Electrical & Optical Systems

Patent Information

1 Patent Involved

Respondent Application Number 10934270

Respondent Patent Number 7378702

External Links

Espacenet

Google Patents

Respondent Inventor Sang-Yun Lee

Respondent Tech Center TC 2800 - Semiconductors, Electrical & Optical Systems

Address and Attorney/Agent Information

Power of Attorney & Correspondence

Firm / Entity Name GREG L. MARTINEZ

Customer Number —

Address 3116 SOUTH MILL AVENUE #408, TEMPE, AZ, 85282, UNITED STATES

Proceeding Documents

140

Petitioner's Notice of Appeal NOTICE

2024-12-20 FILING PARTY: PETITIONER

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Judgment Final Written Decision FINAL

2024-11-13 FILING PARTY: BOARD

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Other: Hearing transcript OTHER

2024-09-17 FILING PARTY: BOARD

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Patent Owner's Updated Exhibit List NOTICE

2024-08-19 FILING PARTY: PATENT OWNER

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2053

Patent Owner's Demonstratives Exhibit

2024-08-19 FILING PARTY: PATENT OWNER

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Petitioner's Updated List of Exhibits NOTICE

2024-08-19 FILING PARTY: PETITIONER

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1063

Petitioner's Demonstratives Exhibit

2024-08-19 FILING PARTY: PETITIONER

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LEAP Practitioner Request and Verification Form (Petitioner) NOTICE

2024-08-16 FILING PARTY: BOARD

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Joint Stipulation To Modify Due Date To Exchange Demonstratives NOTICE

2024-08-13 FILING PARTY: PETITIONER

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ORDER Setting Oral Argument 37 C.F.R. § 42.70 ORDER

2024-07-30 FILING PARTY: BOARD

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Petitioner's Request for Oral Argument OTHER

2024-07-03 FILING PARTY: PETITIONER

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Patent Owner's Request for Oral Argument OTHER

2024-07-03 FILING PARTY: PATENT OWNER

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Patent Owner's Sur-Reply OTHER

2024-06-21 FILING PARTY: PATENT OWNER

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2052

Dr. Jack C. Lee Depo. Transcript (June 12, 2024) Exhibit

2024-06-21 FILING PARTY: PATENT OWNER

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Petitioner's Opposition to Patent Owner's Motion to Strike OPPOSITION

2024-06-12 FILING PARTY: PETITIONER

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Patent Owner's Motion to Strike MOTION

2024-05-29 FILING PARTY: PATENT OWNER

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Joint Stipulation to Modify Due Date 3 OTHER

2024-05-15 FILING PARTY: PATENT OWNER

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Patent Owner's Notice of Deposition of Dr. Jack C. Lee NOTICE

2024-05-15 FILING PARTY: PATENT OWNER

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Patent Owner's Objections to Evidence OTHER

2024-05-10 FILING PARTY: PATENT OWNER

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1055

Frank Niklaus et al., A Method to Maintain Wafer Alignment Precision During Adhesive Wafer Bonding, 107 Sensors & Actuators 273-78 (2003) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1039

Four-level Stack of Watanabe’s Fig. 7 Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1035

Rafael Reif et al., Technology and Applications of Three- Dimensional Integration, 2004 Electrochemical Society Proceedings Volume 261-76 (2004) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1036

Dr. Lee’s Deposition Errata Sheet Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1054

R. L. Smith & S. D. Collins, A Wafer-to-wafer Alignment Technique, 20 Sensors & Actuators 315-16 (1989) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1061

U.S. Patent No. 5,519,236 Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1058

Paolo Pavan, Flash Memory Cells—An Overview, 85 Proc. IEEE 1248 (1997) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1045

Email from Scott DeBoer (Micron), dated July 19, 2016 Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1057

Roberto Bez et al., Introduction to Flash Memory, 91 Proc. IEEE 489-502 (2003) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1048

U.S. Patent No. 6,951,798 Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1053

Jürgen Regner, An Analytical Approach to Quantify the Thermal Budget in Consideration of Consecutive Thermal Process Steps, 10th IEEE Int’l Conference on Advanced Thermal Processing of Semiconductors – RTP 15-20 (2002) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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Petitioner's Reply to Patent Owner's Response REPLYTOOPP

2024-05-03 FILING PARTY: PETITIONER

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1051

Dr. Steven A. Przybylski Deposition Transcript (Apr. 5, 2024) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1033

Y. Beilliard et al., Advances Toward Reliable High Density Cu–Cu Interconnects by Cu-SiO2 Direct Hybrid Bonding, 2014 International 3D Systems Integration Conference (3DIC) (2014) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1040

Certain Semiconductor Chips and Prods. Containing Same, ITC Inv. No. 337-TA-753, 2012 WL 927056 (Mar. 2, 2012) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1044

Email thread from Scott DeBoer (Micron), dated Oct. 10, 2017 Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1034

Perrine Batude et al., 3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS, 2 IEEE J. Emerging and Selected Topics in Circuits and Systems 714-22 (2012) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1059

Keith Thompson, Electromagnetic Fast-Firing for the Rapid Thermal Processing of Silicon (Feb. 25, 2003) (Ph.D. dissertation, University of Wisconsin-Madison) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1049

Gerald Lucovsky et al., Integration of Plasma-Assisted and Rapid Thermal Processing for Low-Thermal Budget Preparation of Ultra- Thin Dielectrics for Stacked-Gate Device Structures, 33 Jpn. J. Appl. Phys. Vol. 7061-70 (1994) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1042

Email thread from Sang-Yun Lee, dated Nov. 8-26, 2007 Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1047

International Technology Roadmap for Semiconductors: Front End Processes (2003) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1043

Sang-Yun Lee & Junil Park, Architecture of 3D Memory Cell Array on 3D IC, IEEE (2012) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1040

Certain Semiconductor Chips and Prods. Containing Same, ITC Inv. No. 337-TA-753, 2012 WL 927056 (Mar. 2, 2012) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1046

Sang-Yun Lee & Junil Park, History and Trend of 3-Dimensional Integrated Circuit Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1050

J. Wong et al., Rapid Thermal Annealing of Deposited 𝑆𝑖𝑂􀬶 Films, 35 Mat. Res. Soc. Symp. Proc. 514-20 (1985) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1056

Updated Guidance for Making a Proper Determination of Obviousness, 89 Fed. Reg. 14,449-453 (Feb. 27, 2024), https://www.federalregister.gov/documents/2024/02/27/2024- 03967/updated-guidance-for-making-a-proper-determination-ofobviousness Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1062

U.S. Patent No. 5,932,920 Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1041

Declaration of Dr. Jack C. Lee in Support of Petitioner’s Reply to Patent Owner’s Response Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1052

D.E. Mercer et al., Will Thermal Budget Really Matter in the Future, 2001-9 Electrochemical Soc. Proceedings 247 (2000) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1060

Keith Thompson et al., Direct Silicon-Silicon Bonding by Electromagnetic Induction Heating, 11 J. Microelectromechanical Sys. 285-92 (2002) Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1038

Two-level Stack of Watanabe’s Fig. 7 Exhibit

2024-05-03 FILING PARTY: PETITIONER

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1037

SEM Image Exhibit

2024-05-03 FILING PARTY: PETITIONER

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Petitioner’s Notice of Deposition of Dr. Steven A. Przybylski NOTICE

2024-02-22 FILING PARTY: PETITIONER

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Patent Owner's Response to Petition for Inter Partes Review RESPONSE

2024-02-16 FILING PARTY: PATENT OWNER

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2030

CV of Steven A. Przybylski Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2038

2/16/2024 Board email Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2023

'994 Patent, Fig. 12B (annotated by Dr. Lee) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2027

Batude, 3-D Sequential Information (2012) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2032

Random House Dictionary excerpt (1997) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2029

Declaration of Steven A. Przybylski Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2021

Bez, Intro to Flash Memory Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2026

'994 Patent, Fig. 12B (annotated by Dr. Lee) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2036

Itoh, VLSI Memory Chip Design (2001) (excerpts) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2034

Keeth, DRAM Circuit Design Fundamental (2008) (excerpts) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2035

Keeth, DRAM Circuit Design Tutorial (2001) (excerpts) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2031

Webster's Dictionary excerpt (2003) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2033

May, Fundamentals of Semiconductor Manufacturing (2006)(excerpts) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2024

'994 Patent, Fig. 12B (annotated by Dr. Lee) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2028

Dr. Jack C. Lee Depo. Transcript (Feb. 6, 2024) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2022

Executive Summary, ITRS (2003) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2037

Interconnect, ITRS (2007) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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2025

'994 Patent, Fig. 12B (annotated by Dr. Lee) Exhibit

2024-02-16 FILING PARTY: PATENT OWNER

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Joint Stipulation to Modify Due Date 1 OTHER

2024-01-12 FILING PARTY: PATENT OWNER

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Patent Owner's Amended Notice of Deposition of Dr. Jack C. Lee NOTICE

2024-01-12 FILING PARTY: PATENT OWNER

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Patent Owner's Notice of Deposition of Dr. Jack C. Lee NOTICE

2024-01-03 FILING PARTY: PATENT OWNER

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Mandatory Notices Pursuant to 37 C.F.R. §42.8(a)(2) NOTICE

2023-12-29 FILING PARTY: PETITIONER

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Petitioner's Updated Mandatory Notices Pursuant to 37 C.F.R. §42.8(a)(2) NOTICE

2023-12-29 FILING PARTY: PETITIONER

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Petitioner's Updated List of Exhibits NOTICE

2023-12-27 FILING PARTY: PETITIONER

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1032

BeSang, Inc. v. Micron Technology Inc. et al., 2:23-CV-00028-JRG-RSP, D.I. 95 (E.D. Tex. Dec. 20, 2023), Order Granting Stipulation and Joint Motion to Stay Pending Inter Partes Review (“Order Granting Stay”) Exhibit

2023-12-27 FILING PARTY: PETITIONER

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Patent Owner's Objections to Evidence OTHER

2023-12-04 FILING PARTY: PATENT OWNER

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Order: Scheduling Order ORDER

2023-11-17 FILING PARTY: BOARD

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Institution Decision: Grant DECISION

2023-11-17 FILING PARTY: BOARD

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2020

9-14-2023 Email from Board Authorizing Preliminary Reply and Sur-Reply Briefing Exhibit

2023-09-28 FILING PARTY: PATENT OWNER

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Patent Owner's Preliminary Sur-Reply OTHER

2023-09-28 FILING PARTY: PATENT OWNER

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1031

Letter dated September 21, 2023 to counsel for Patent Owner from John Kappos Exhibit

2023-09-21 FILING PARTY: PETITIONER

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Petitioner's Preliminary Reply In Support of Inter Partes Review of U.S. Patent No. 7,378,702 REPLYTOOPP

2023-09-21 FILING PARTY: PETITIONER

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2015

7-30-2007 Email exchange between Tom Arnold, Sang-Yun Lee, and others Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2010

Press Release, Micron and Intel Extend their Leadership (May 21, 2018) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2005

Mutschler, Stanford, Korean nanofab center, EDN (Aug. 13, 2008) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2004

Defs' Patent L.R. 3-3 Invalidity Contentions, BeSang v. Micron (E.D. Tex. July 11, 2023) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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Patent Owner's Preliminary Response POPR

2023-08-28 FILING PARTY: PATENT OWNER

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2007

Clarke, EE Times updates list of emerging startups (Feb. 2, 2009) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2014

1-29-2007 Email from Peter Feeley to BeSang Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2002

Docket Re BeSang v. Micron (E.D. Tex.) (as of Aug. 28, 2023) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2008

GSA Forum, Exploring the Potential of Emerging Semiconductor Technology (June 2011) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2011

Micron Unveils 3D NAND (Mar. 26, 2015) (video file) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2012

Radar Scope, Semiconductor Times (Apr. 2007) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2001

First Amended Docket Control Order, BeSang v. Micron (E.D. Tex. June 21, 2023) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2009

Frost & Sullivan, Looking Beyond TSV For 3D IC Technology (Mar. 2009) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2019

US District Courts – Federal Court Management Statistics (June 30, 2023) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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2006

Press Release, Micron and Intel Unveil New 3D NAND Flash Memory (Mar. 26, 2015) Exhibit

2023-08-28 FILING PARTY: PATENT OWNER

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Notice: Notice filing date accorded NOTICE

2023-05-26 FILING PARTY: BOARD

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Notice : Mandatory Notice NOTICE

2023-05-25 FILING PARTY: PATENT OWNER

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Notice : Power of Attorney NOTICE

2023-05-25 FILING PARTY: PATENT OWNER

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