Reed Semiconductor Corporation vs. Monolithic Power Systems, Inc.
Explore the PTAB proceeding IPR2024-00871 filed by Reed Semiconductor Corporation on 2024-05-17. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.
Proceeding Overview
Proceeding Number
IPR2024-00871
Filing Date
2024-05-17
Accorded Filing Date
2024-05-17
Institution Decision Date
2024-11-26
Last Modified Date
2025-02-04
Proceeding Type
IPR
Termination Date
2024-11-26
Trial Status
Institution Denied
Parties & Counsel
Petitioner
Reed Semiconductor Corporation
Represented By
Miller, Ryanet alPatent Owner / Respondent
Monolithic Power Systems, Inc.
Represented By
Schnurer, Johnet alTribunal & Venue
Tribunal
Patent Trial and Appeal Board (USPTO)
Technology Center
TC 2800 - Semiconductors, Electrical & Optical Systems
Patent Information
Respondent Application Number
14823900
Respondent Patent Number
9590608
External Links
Respondent Inventor
Li Xu
Respondent Tech Center
TC 2800 - Semiconductors, Electrical & Optical Systems
Address and Attorney/Agent Information
Power of Attorney & Correspondence
Firm
/ Entity Name
Perkins Coie LLP - Monolithic Power Systems
Customer
Number
67394
Address
P.O. BOX 1247, SEATTLE, WA, 98111-1247, UNITED STATES
Attorney / Agent Information
| Reg # | Name | Phone |
|---|---|---|
| 31646 | Kenneth Ohriner | 310-788-3267 |
| 36878 | Chun Ng | 206-359-800 |
| 37263 | Robert Woolston | 206-359-3259 |
| 38264 | Paul Parker | 206-287-3258 |
| 38829 | Stephen Bishop | 206-359-3129 |
| 43312 | Bing Ai | 858-720-5707 |
| 52196 | John Schnurer | 858-720-5705 |
| 54675 | Aaron Poledna | 206--35-9-8000 |
Proceeding Documents
56
8
Notice: refund approved NOTICE
2025-02-04
FILING PARTY: BOARD
7
IPR Fee Refund Request OTHER
2025-01-27
FILING PARTY: PETITIONER
6
Institution Decision: DECISION Denying Institution of Inter Partes Review 35 U.S.C. § 314 DECISION
2024-11-26
FILING PARTY: BOARD
5
Patent Owner's Preliminary Response POPR
2024-09-03
FILING PARTY: PATENT OWNER
2014
Ex. 2014 Exhibit
2024-09-03
FILING PARTY: PATENT OWNER