Taiwan Semiconductor Manufacturing Company Ltd. et al. vs. MYW Semitech, LLC
Explore the PTAB proceeding IPR2026-00065 filed by Taiwan Semiconductor Manufacturing Company Ltd. et al. on 2025-11-21. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.
Proceeding Overview
Proceeding Number
IPR2026-00065
Filing Date
2025-11-21
Accorded Filing Date
2025-11-21
Institution Decision Date
2026-05-06
Last Modified Date
2026-09-11
Proceeding Type
IPR
Termination Date
—
Trial Status
Trial Instituted
Parties & Counsel
Petitioner
Patent Owner / Respondent
MYW Semitech, LLC
Represented By
Jackson, Donaldet alTribunal & Venue
Tribunal
Patent Trial and Appeal Board (USPTO)
Technology Center
TC 2800 - Semiconductors, Electrical & Optical Systems
Patent Information
Address and Attorney/Agent Information
Power of Attorney & Correspondence
Proceeding Documents
181Petitioners Notice of Deposition of Dr. Ricketts NOTICE
Exhibit 2023 Exhibit
Exhibit 2022 Exhibit
Patent Owner's Response to Petition RESPONSE
Exhibit 2019 Exhibit
Exhibit 2020 Exhibit
Exhibit 2021 Exhibit
Exhibit 2018 Exhibit
Joint Stipulation to Modify Trial Due Dates 1-3 OTHER
Patent Owner's Notice of Deposition of Dr. Stanley Shanfield NOTICE
Ex. 3102 Request to File Stay Order; TSMC, et al. v. MYW Semitech - Granted Exhibit
EX1160-MYW Semitech, LLC v. Apple Inc., Case No. 1:25-cv-00504, Dkt. 118, Order to Stay (D. Del. June 16, 2026) Exhibit
Petitioners' Updated Exhibit List NOTICE
Order Denying Director Review of Institution Decision REHEARING
Panel Change Order ORDER
Scheduling Order ORDER
Order Granting-In-Part Patent Owner’s Motion to Seal ORDER
Authorized Response to Director Review Request OTHER
Patent Owner's Updated Mandatory Notices NOTICE
Petitioners' Objections to Admissibility of Evidence OTHER
Exhibit 2016 Exhibit
Exhibit 2017 Exhibit
Patent Owner's Request for Director Review REQUEST
Ex. 3101 - Counsel email for authorized response Exhibit
Ex. 3100 RE_ TSMC, et al. v. MYW Semitech IPR2026-00065 Patent Owner's Request - Granted Exhibit
Institution Decision: Grant DECISION
Director Discretionary Decision: Refer RESPONSE
Petitioners' Sur-Reply to Patent Owner's Request for Discretionary Denial OTHER
Patent Owner’s Authorized Preliminary Sur-Reply OTHER
Petitioners' Reply to Patent Owner's Preliminary Response OTHER
Patent Owner’s Authorized Response to Petitioners’ Opposition to Discretionary Denial OTHER
Email correspondence Exhibit
EX1150-Docket Navigator’s Statistics for Judge Andrew’s Motion for Stay Pending IPR (Post-Institution) Success Exhibit
Petitioners’ Opposition to Patent Owner’s Request for Discretionary Denial RESPONSE
Exhibit 2014 Exhibit
EX1144-Search Results from PatSeer Exhibit
EX1139-Revision to Rules of Practice Before the Patent Trial and Appeal Board, 90 Fed. Reg. 48335 (Oct. 17, 2025) (to be codified at 37 CFR pt. 42) Exhibit
EX1152-CNBC Transcript: United States Commerce Secretary Howard Lutnick Speaks with CNBC’s Brian Sullivan on “The Exchange” Today, CNBC (Apr. 29. 2025), available at https://www.cnbc.com/2025/04/29/cnbc-transcript-united-states-commerce-secretary-howard-lutnick-speaks-with-cnbcs-brian-sullivan-on-the-exchange-today.html Exhibit
EX1153-Trump on China Putting - America First (Robert C. O’Brien editor) Exhibit
EX1146-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Dkt. 18, Amended Complaint (D. Del. July 7, 2025) Exhibit
EX1151-Chief Administrative Patent Judge Boalick’s Memorandum dated March 24, 2025 Exhibit
EX159-Silvia Pellegrino, What is TSMC?, Tech Monitor (Jan. 2, 2023), available at https://www.techmonitor.ai/what-is/what-is-tsmc/?cf-view Exhibit
EX1140-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Dkt. 26, Scheduling Order (D. Del. Sept. 5, 2025) Exhibit
EX1143-USPTO CPC Scheme for H01L Classification (excerpt), available at https://www.uspto.gov/web/patents/classification/cpc/html/cpc-H01L.html Exhibit
EX1149-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Dkt. 87, Apple’s Responsive Letter (D. Del. Feb. 13, 2025) Exhibit
Patent Owner's Preliminary Response POPR
EX1157-Jeremy Bowman, Nasdaq, This 1 Number May Ensure TSMC’s Market Dominance, The Motley Fool (Aug. 17, 2024), available at https://www.nasdaq.com/articles/1-number-may-ensure-tsmcs-market-dominance Exhibit
EX1145-Apple iPhone 7 Introduction Press Release, dated Sept. 7, 2016 Exhibit
EX1142-WIPO IPC H01L Classifications Webpage, available at https://www.wipo.int/classifications/ipc/en/ITsupport/Version20170101/transformations/ipc/20170101/en/htm/H01L.htm Exhibit
EX1155-Speech: Donald Trump Addresses a Republican Dinner in Washington - April 8, 2025, available at https://rollcall.com/factbase/trump/transcript/donald-trump-speech-nrcc-republican-dinner-april-8-2025/#161 Exhibit
EX1147-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Dkt. 83, Order (D. Del. Feb. 12, 2026) (“Semitech Order”) Exhibit
EX1156-Another Historic Investment Secured Under President Trump, Articles, The White House (Mar. 3, 2025), available at https://www.whitehouse.gov/articles/2025/03/another-historic-investment-secured-under-president-trump/ Exhibit
EX1158-TSMC Arizona Webpage, available at https://www.tsmc.com/static/abouttsmcaz/index.htm Exhibit
Exhibit 2015 Exhibit
EX1148-MYW Semitech, LLC v. Apple Inc., No. 1:25-cv-00504, Hearing Transcript (D. Del. Feb. 12, 2026) (“Hearing Transcript”) Exhibit
Petitioners’ Opposition to Patent Owner’s Motion to Seal and Petitioners’ Unopposed Request to Modify Default Protective Order OPPOSITION
EX1154-Remarks: Donald Trump Announces an Economic Investment in the United States - March 3, 2025, available at https://rollcall.com/factbase/trump/transcript/donald-trump-remarks-economic-investment-united-states-march-3-2025/#2 Exhibit
EX1141-Search Results from Patent Public Search Exhibit
Exhibit 2008 Exhibit
Exhibit 2012 Exhibit
Patent Owner's Motion for Entry of Default Protective Order and Motion to Seal MOTION
Exhibit 2010 Exhibit
Exhibit 2013 Exhibit
Exhibit 2001 Exhibit
Exhibit 2002 Exhibit
Patent Owner's Discretionary Denial Brief RESPONSE
Exhibit 2007 Exhibit
Exhibit 2011 Exhibit
Exhibit 2009 Exhibit
Petitioners' Updated Exhibit List NOTICE
EX1138-Email to Patent Owner’s Counsel with Stipulation Exhibit
Notice: Power of Attorney NOTICE
Notice: Mandatory Notice NOTICE
NOTICE OF FILING DATE ACCORDED TO PETITION AND TIME FOR FILING PATENT OWNER PRELIMINARY RESPONSE NOTICE
EX1088-U.S. Patent No. 6,611,046 to Yang Exhibit
EX1029-U.S. Patent Publication No. 2003/0068877 to Kinsman Exhibit
EX1037-U.S. Patent No. 7,374,969 to Cho, et al. Exhibit
EX1087-U.S. Patent No. 5,834,945 to Akram, et al. Exhibit
EX1040-U.S. Patent No. 6,619,538 to Test, et al. Exhibit
EX1022-U.S. Patent No. 6,818,545 to Lee, et al. Exhibit
EX1095-U.S. Patent No. 6,452,502 to Dishongh, et al. Exhibit
EX1086-U.S. Patent Publication No. 2003/0013298 to May Exhibit
EX1082-U.S. Patent No. 6,982,874 to Smalc, et al. Exhibit
EX1025-U.S. Patent Publication No. 2012/0098124 to Wu, et al. Exhibit
EX1102-Linely Gwennap, Sandy Bridge Spans Generations Exhibit
EX1030-U.S. Patent Publication No. 2010/0246152 to Lin, et al. Exhibit
EX1047-U.S. Patent Publication No. 2009/0174052 to Sogawa, et al. Exhibit
EX1003 - Declaration Dr Shanfield '768 Patent Exhibit
EX1096-U.S. Patent No. 6,344,401 to Lam Exhibit
EX1132-U.S. Patent No. 7,169,627 to Duh, et al. Exhibit
EX1089-U.S. Patent No. 7,638,254 to Hattori, et al. Exhibit
EX1078-U.S. Patent Publication No. 2012/0139068 to Stacey Exhibit
EX1012-Andrea Chen, et al. Semiconductor Packaging Materials Interaction Exhibit
EX1091-U.S. Patent Publication No. 2011/0215470 to Chen, et al. Exhibit
EX1045-U.S. Patent Publication No. 2010/0244245 to Pendse, et al. Exhibit
EX1067-U.S. Patent Publication No. 2012/0098114 to Ishibashi Exhibit
EX1010-U.S. Patent No. 9,123,763 to Yu, et al. Exhibit
EX1023-U.S. Patent No. 6,974,659 to Su, et al. Exhibit
EX1085-U.S. Patent No. 6,946,727 to Ho, et al. Exhibit
EX1035-E.D. Blackshear, et al, The evolution of build-up package technology Exhibit
EX1108-U.S. Patent No. 7,095,105 to Cherukuri, et al. Exhibit
EX1113-U.S. Patent Publication No. 2005/0121711 to Pogge, et al. Exhibit
EX1080-U.S. Patent Publication No. 2012/0319251 to Yu, et al. Exhibit
EX1020-U.S. Patent No. 5,086,558 to Grube, et al. Exhibit
EX1015-U.S. Patent No. 7,902,648 to Lee Exhibit
EX1055-U.S. Patent No. 6,578,178 to Mau Exhibit
EX1084-U.S. Patent No. 7,759,782 to Haba, et al. Exhibit
EX1043-U.S. Patent Publication No. 2009/0226611 to Suzuki, et al. Exhibit
EX1071-U.S. Patent No. 7,649,368 to Eldridge, et al. Exhibit
EX1016-U.S. Patent No. 7,964,961 to Lee, et al. Exhibit
EX1042-U.S. Patent No. 6,831,003 to Huang, et al. Exhibit
EX1098-Mulugeta Abtew, et al., Lead-free Solders in Microelectronics Exhibit
EX1133-U.S. Patent No. 6,614,243 to Klehn, et al. Exhibit
EX1044-U.S. Patent No. 6,077,726 to Mistry, et al. Exhibit
EX1097-Richard K. Ulrich, et al., Advanced Electronic Packaging, IEEE Press Exhibit
EX1109-U.S. Patent No. 7,423,347 to Chen, et al. Exhibit
EX1050-U.S. Patent No. 8,116,097 to Love, et al. Exhibit
EX1046-U.S. Patent Publication No. 2012/0206160 to Wu, et al. Exhibit
EX1065-U.S. Patent Publication No. 2011/0147950 to Tai, et al. Exhibit
EX1107-U.S. Patent No. 7,777,333 to Bachman, et al. Exhibit
Petitioner Apple Power of Attorney NOTICE
EX1128-U.S. Patent No. 6,528,179 to Jimarez, et al. Exhibit
EX1105-U.S. Patent Publication No. 2011/0059305 to Kaneya, et al. Exhibit
EX1019-U.S. Patent Publication No. 2011/0026232 to Lin, et al. Exhibit
EX1052-U.S. Patent Publication No. 2005/0002167 to Hsuan, et al. Exhibit
EX1031-Yi Yang, et al, CPU-Assisted GPGPU on Fused CPU-GPU Architectures Exhibit
EX1116-U.S. Patent Publication No. 2013/0037944 to Lee, et al. Exhibit
EX1094-U.S. Patent Publication No. 2011/0210283 to Ramirez, et al. Exhibit
EX1111-U.S. Patent Publication No. 2008/0042280 to Lin, et al. Exhibit
EX1115-U.S. Patent No. 7,262,444 to Fillion, et al. Exhibit
EX1066-U.S. Patent Publication No. 2009/0070727 to Solomon Exhibit
EX1053-U.S. Patent Publication No. 2008/0067695 to Chow, et al. Exhibit
EX1028-Philip Garrou, Introduction to 3D Integration Exhibit
EX1004-U.S. Patent No. 9,167,694 to Sundaram, et al. Exhibit
EX1104-U.S. Patent No. 6,710,447 to Nogami Exhibit
EX1137-U.S. Patent No. 6,407,341 to Anstrom, et al. Exhibit
EX1005-U.S. Patent Publication No. 2010/0290191 to Lin, et al. Exhibit
EX1081-U.S. Patent No. 7,838,759 to Alley, et al. Exhibit
EX1021-U.S. Patent Publication No. 2011/0193219 to Lai, et al. Exhibit
EX1135-U.S. Patent No. 6,570,259 to Alcoe, et al. Exhibit
EX1063-U.S. Patent No. 6,812,143 to Lane, et al. Exhibit
EX1112-U.S. Patent No. 7,923,836 to Farooq, et al. Exhibit
EX1090-U.S. Patent Publication No. 2005/0156280 to Patel, et al. Exhibit
EX1059-U.S. Patent No. 6,506,672 to Dagenais, et al. Exhibit
EX1057-U.S. Patent No. 7,307,348 to Wood, et al. Exhibit
EX1083-U.S. Patent Publication No. 2009/0166069 to Kinoshita Exhibit
EX1136-U.S. Patent No. 7,741,567 to Beddingfield, et al. Exhibit
EX1054-U.S. Patent No. 6,489,240 to Iacoponi, et al. Exhibit
Petition for Inter Partes Review of U.S. Patent No. 11,107,768 PETITION
EX1001-U.S. Patent No. 11,107,768 Exhibit
EX1061-U.S. Patent Publication No. 2009/0261473 to Lee, et al. Exhibit
EX1099-Karl J. Puttlitz, et al., Handbook of Lead-Free Solder Technology Exhibit
EX1017-U.S. Patent No. 7,241,641 to Savastiouk, et al. Exhibit
EX1056-U.S. Patent Publication No. 2012/0001190 to Okabe, et al. Exhibit
EX1049-U.S. Patent No. 7,047,515 to Vitek, et al. Exhibit
EX1131-U.S. Patent Publication No. 2011/0186977 to Chi, et al. Exhibit
Petitioner TSMC Power of Attorney NOTICE
EX1100-U.S. Patent Publication No. 2013/0309832 to Cheng, et al. Exhibit
EX1026-U.S. Patent No. 8,193,604 to Lin et al. Exhibit
EX1110-U.S. Patent Publication No. 2008/0128891 to Ziglioli, et al. Exhibit
EX1018-U.S. Patent Publication No. 2005/0110168 to Chuang Exhibit
EX1129-U.S. Patent No. 6,468,413 to Fanti, et al. Exhibit
EX1051-U.S. Patent Publication No. 2009/0237900 to Origuchi, et al. Exhibit
EX1048-U.S. Patent Publication No. 2013/0100624 to Carpenter, et al. Exhibit
EX1006-U.S. Patent Publication No. 2011/0215458 to Camacho, et al. Exhibit
EX1002-File History of the ’768 Patent Exhibit
EX1068-U.S. Patent Publication No. 2011/0074028 to Pendse Exhibit
EX1101-U.S. Patent Publication No. 2013/0151869 to Steinman, et al. Exhibit
EX1114-U.S. Patent Publication No. 2012/0313240 to Cheng, et al. Exhibit
EX1024-U.S. Patent Publication No. 2006/0175686 to Murata, et al. Exhibit
EX1126-U.S. Patent No. 8,592,988 to Lee, et al. Exhibit
EX1093-U.S. Patent No. 6,107,180 to Munroe, et al. Exhibit
EX1009-U.S. Patent No. 8,709,933 to Haba, et al. Exhibit
EX1106-U.S. Patent No. 7,057,896 to Matsuo, et al. Exhibit
EX1092-Moody Dreiza, et al., High Density PoP (Package-on-Package) Exhibit
EX1013-Philip Garrou, et al., RDL an integral part of today’s advanced pack Exhibit
EX1027-U.S. Patent Publication No. 2004/0203224 to Halahan, et al. Exhibit
EX1014-U.S. Patent No. 8,780,576 to Haba, et al. Exhibit
EX1058-U.S. Patent No. 8,138,014 to Chi, et al. Exhibit
EX1130-U.S. Patent No. 8,132,775 to Goldmann Exhibit
EX1134-U.S. Patent Publication No. 2009/0162622 to Van Veen, et al. Exhibit
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