Taiwan Semiconductor Manufacturing Company Ltd. vs. Marlin Semiconductor Ltd. et al.

Explore the PTAB proceeding IPR2026-00220 filed by Taiwan Semiconductor Manufacturing Company Ltd. on 2026-01-16. This includes filing dates, application numbers, tech centers, patent numbers, and current case status.

Proceeding Overview

Proceeding Number

IPR2026-00220

Filing Date

2026-01-16

Accorded Filing Date

2026-01-16

Institution Decision Date

2026-06-23

Last Modified Date

2026-07-27

Proceeding Type

IPR

Termination Date

2026-07-27

Trial Status

Terminated-Settled

Parties & Counsel

Petitioner

Taiwan Semiconductor Manufacturing Company Ltd.

Represented By

Renner, W. Karlet al

Patent Owner / Respondent

Marlin Semiconductor Ltd. et al.

Represented By

Meunier, Williamet al

Tribunal & Venue

Tribunal

Patent Trial and Appeal Board (USPTO)

Technology Center

TC 2800 - Semiconductors, Electrical & Optical Systems

Patent Information

1 Patent Involved

Respondent Application Number 12572498

Respondent Patent Number 8076735

External Links

Espacenet

Google Patents

Respondent Inventor Chun-Hsien Lin

Respondent Tech Center TC 2800 - Semiconductors, Electrical & Optical Systems

Address and Attorney/Agent Information

5 Registered Practitioners

Power of Attorney & Correspondence

Firm / Entity Name WPAT, PC - INTELLECTUAL PROPERTY ATTORNEYS

Customer Number 65358

Address 8230 BOONE BLVD. SUITE 405, VIENNA, VA, 22182, UNITED STATES

Attorney / Agent Information

Reg #	Name	Phone
00051	Attorneytest Atest2	000-000-0000
49063	Anthony King	949-387-2885
50464	Justin King	703-639-0151
58774	Marc Thompson	715-424-2809
67988	Siying Chen	703-639-0151 EXT. 10

Proceeding Documents

Termination Decision: ORDER Granting Motions to Terminate Granting Motions to Treat Settlement Agreement as Business Confidential Information 35 U.S.C. § 317; 37 C.F.R. §§ 42.72, 42.74(c) TERMINATE

2026-07-27 FILING PARTY: BOARD

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Joint Motion to Terminate Proceedings MOTION

2026-07-22 FILING PARTY: PATENT OWNER

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Joint Motion to File Settlement Agreement as Business Confidential Information MOTION

2026-07-22 FILING PARTY: PATENT OWNER

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SCHEDULING ORDER 37 C.F.R. § 42.5 ORDER

2026-06-29 FILING PARTY: BOARD

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Institution Decision: Grant DECISION

2026-06-23 FILING PARTY: BOARD

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Taiwan Semiconductor Manufacturing Company Ltd. vs. Marlin Semiconductor Ltd. et al.

Proceeding Overview

Parties & Counsel

Petitioner

Taiwan Semiconductor Manufacturing Company Ltd.

Represented By

Patent Owner / Respondent

Marlin Semiconductor Ltd. et al.

Represented By

Tribunal & Venue

Patent Information

Address and Attorney/Agent Information

Power of Attorney & Correspondence

Attorney / Agent Information

Proceeding Documents

Termination Decision: ORDER Granting Motions to Terminate Granting Motions to Treat Settlement Agreement as Business Confidential Information 35 U.S.C. § 317; 37 C.F.R. §§ 42.72, 42.74(c) TERMINATE

Joint Motion to Terminate Proceedings MOTION

Joint Motion to File Settlement Agreement as Business Confidential Information MOTION

SCHEDULING ORDER 37 C.F.R. § 42.5 ORDER

Institution Decision: Grant DECISION

Director Discretionary Decision: Refer RESPONSE

Patent Assignment Abstract of Title for the ’735 Patent Exhibit

VectorCapital.com About Webpage, available at https://www.vectorcapital.com/about (last accessed April 22, 2026) Exhibit

Ex 2002 Peter Van Zant Microchip Fabrication 4th Edition Exhibit

Jeremy Bowman, Nasdaq, This 1 Number May Ensure TSMC’s Market Dominance, The Motley Fool Exhibit

TSMC Annual Report 2024 (Excerpts), available at https://investor.tsmc.com/static/annualReports/2024/english/ebook/i ndex.html (last accessed Feb. 25, 2026) Exhibit

IPValue.com Portfolios Webpage, available at https://www.ipvalue.com/portfolios Exhibit

“Another Historic Investment Secured Under President Trump,” The White House, Published Mar. 3, 2025 Exhibit

Certain Foreign-Fabricated Semiconductor Devices, Products Containing the Same, and Components Thereof, Inv. No. 337-TA1443, Doc ID 843707 (Feb. 18, 2025) (Complaint) Exhibit

Director John A. Squires, Memorandum on Additional Discretionary Institution Considerations – U.S. Manufacturing and Small Business Use of AIA Proceedings (March 11, 2026) Exhibit

J. Klearman, “Decoding TSMC’s Contribution to the AI and 5G Ecosystem,” Nov. 20, 2024, available at https://graniteshares.com/institutional/us/en-us/research/decodingtsmc-s-contribution-to-the-ai-and-5g-ecosystem/ (last accessed Feb. 25, 2026) Exhibit

Greater Phoenix Semiconductor Ecosystem February 2025 Report, available at https://www.gpec.org/industries-operations/industries-in-greater-phoenix/semiconductors (last accessed April 12, 2026) Exhibit

TSMC Arizona Economic Impact, available at https://www.tsmc.com/static/abouttsmcaz/index.htm (last accessed April 12, 2026) Exhibit

USPC Class 257 Definition Exhibit

Taiwan Semiconductor Manufacturing Company Ltd., 7nm Technology Exhibit

Patent Owner's Preliminary Response POPR

“CNBC Transcript: United States Commerce Secretary How-ard Lutnick Speaks with CNBC’s Brian Sullivan on ‘The Ex-change’ Today,” CNBC, Published Apr. 29, 2025 Exhibit

VectorCapital.com IPValue Management Investment Case Study Webpage, available at https://www.vectorcapital.com/investments/case-study/ipvalue-management (last accessed April 22, 2026) Exhibit

U.S. Patent No. 10,811,320 (“Huang”) Exhibit

Ex 2003 CV of Joseph McAlexander, III Exhibit

Russ Wiles, US Commerce Secretary Visits TSMC Complex in Phoenix as Work on Third Fab Starts, Arizona Republic (April 30, 2025) Exhibit

“IPValue Affiliate Licenses Samsung to Marlin Semiconductor Patent Portfolio" IP Value Exhibit

R. O’Brien, “Trump on China – Putting America First,” available at https://trumpwhitehouse.archives.gov/wpcontent/uploads/2020/11/Trump-on-China-Putting-AmericaFirst.pdf (last accessed Feb. 25, 2026) Exhibit

USPC Class 438 Definition Exhibit

“Removing Barriers to American Leadership in Artificial Intel-ligence,” The White House, Published Jan. 23, 2025, availa-ble at https://www.whitehouse.gov/presidentialactions/2025/01/removing-barriers-to-american-leadership-inartificial-intelligence/ (last accessed Feb. 25, 2026) Exhibit

TSMC-Cadence Press Release, Published Apr. 24, 2025, available at https://www.cadence.com/en_US/home/company/newsroom/pressreleases/pr/2025/cadence-and-tsmc-advance-ai-and-3d-ic-chipdesign-with-certified.html (last accessed Feb. 25, 2026) Exhibit

Petitioner's Opposition to Patent Owner's Request for Discretionary Denial RESPONSE

“IPValue Affiliate Licenses Samsung to Marlin Semiconductor Patent Portfolio" BusinessWire Exhibit

Ex 2001 2026-04-22 IPR2026-00220 '735 McAlexander Declaration Exhibit

U.S. Patent No. 10,453,842 (“Ching”) Exhibit

Ex. 2105 Memo fr J. Squires to all PTAB Users (Mar. 11, 2026) Exhibit

Ex. 2108 samsung-factsheet-chips-122024-final Exhibit

Ex. 2107 US Semiconductor Manufacturing _ CHIPS and Science Act _ Intel® Exhibit

Ex. 2102 Ranked_Semiconductor Foundries by Revenue Share Exhibit

Ex. 2103 US8076735B2 - Semiconductor device with trench of various widths - Google Patents Exhibit

Ex. 2109 Samsung CHIPS Act Grant Brings Its Leading Edge Plus R&D To Texas Exhibit

Ex. 2104 2026-03-23 IPR2026-00220 '735 Ahern Declaration (MSL executed) Exhibit

Ex. 2106 chips-design-manufacturing-fact-sheet Exhibit

Patent Owner's Request for Discretionary Denial of Institution RESPONSE

Ex. 2101 Foundries to Grow Faster than Integrated Circuits in 2016 Exhibit

Notice: Power of Attorney NOTICE

Notice: Mandatory Notice NOTICE

Notice: Notice filing date accorded NOTICE

Auth 2008 Exhibit

U.S. Pub. No. 2010/0006955 (“Takimoto”) Exhibit

E.P. Patent No. 1,637,626 (“Ji”) Exhibit

U.S. Patent No. 8,076,735 to Lin (“the ’735 Patent”) Exhibit

U.S. Pub. No. 2010/0065926 (“Yeh”) Exhibit

U.S. Patent No. 6,348,385 (“Cha“) Exhibit

U.S. Patent No. 9,166,022 B2 (“Xu”) Exhibit

U.S. Pub. No. 2007/0037343 (“Colombo”) Exhibit

U.S. Pub. No. 2006/0115937 (“Barnett”) Exhibit

U.S. Patent No. 6,225,168 (“Gardner”) Exhibit

U.S. Pub. No. 2010/0044783 (“Chuang”) Exhibit

U.S. Patent No. 7,176,090 (“Brask”) Exhibit

U.S. Patent No. 7,208,361 (“Shah”) Exhibit

U.S. Pub. No. 2009/0218603 (“Brask-603”) Exhibit

Mayuzumi 2009 Exhibit

U.S. Pub. No. 2006/0011994 (“Hong Lin”) Exhibit

Excerpts from the Prosecution History of the ’735 Patent Exhibit